System on Package: Miniaturization of the Entire System

System on Package: Miniaturization of the Entire System
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作者:
2008-04
版次: 1
ISBN: 9780071459068
定价: 925.50
装帧: 精装
开本: 其他
纸张: 其他
页数: 785页
正文语种: 英语
1人买过
  • System-on-Package(SOP)isanemergingmicroelectronictechnologythatplacesanentiresystemonasinglechip-sizepackage.Where“systems”usedtobebulkyboxeshousinghundredsofcomponents,SOPsavesinterconnectiontimeandheatgenerationbykeepafullsystemwithcomputing,communications,andconsumerfunctionsallinasinglechip.WrittenbytheGeorgiaTechdevelopersofthetechnology,thisbookexplainsthebasicparameters,designfunctions,andmanufacturingissues,showingelectronicdesignershowthisradicalnewpackagingtechnologycanbeusedtosolvepressingelectronicsdesignchallenges. Dr.RaoTummala(Atlanta,GA)isPettitChairProfessorandDirectorofthePackagingResearchCenteratGeorgiaTech.Heisapast-PresidentofISHM,anIEEEFellow,andtheGeneralChairofIEEE-ICTC.HewasrecentlynamedbyIndustryWeekasoneofthe50StarsintheUSforimprovingnationalcompetitiveness.
  • 内容简介:
    System-on-Package(SOP)isanemergingmicroelectronictechnologythatplacesanentiresystemonasinglechip-sizepackage.Where“systems”usedtobebulkyboxeshousinghundredsofcomponents,SOPsavesinterconnectiontimeandheatgenerationbykeepafullsystemwithcomputing,communications,andconsumerfunctionsallinasinglechip.WrittenbytheGeorgiaTechdevelopersofthetechnology,thisbookexplainsthebasicparameters,designfunctions,andmanufacturingissues,showingelectronicdesignershowthisradicalnewpackagingtechnologycanbeusedtosolvepressingelectronicsdesignchallenges.
  • 作者简介:
    Dr.RaoTummala(Atlanta,GA)isPettitChairProfessorandDirectorofthePackagingResearchCenteratGeorgiaTech.Heisapast-PresidentofISHM,anIEEEFellow,andtheGeneralChairofIEEE-ICTC.HewasrecentlynamedbyIndustryWeekasoneofthe50StarsintheUSforimprovingnationalcompetitiveness.
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