微电子封装组件的建模和仿真：制造可靠性与测试

微电子封装组件的建模和仿真：制造可靠性与测试

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作者: 刘胜著 , 刘勇著

出版社: 化学工业出版社

出版时间: 2012-01

版次: 1

ISBN: 9787122123725

定价: 298.00

装帧: 精装

开本: 16开

纸张: 其他

页数: 564页

分类: 工程技术

9人买过

　　随着电子封装的发展，电子封装已从传统的四个主要功能（电源系统、信号分布及传递、散热及机械保护）扩展为六个功能，即增加了DFX及系统测试两个新的功能。其中DFX是为“X”而设计，X包括：可制造性、可靠性、可维护性、成本，甚至六西格玛。DFX有望在产品设计阶段实现工艺窗口的确定、可靠性评估和测试结构及参数的设计等功能，真正做到“第一次就能成功”，从而将计算机辅助工程（CAE）变为计算机主导工程（CE），以大大加速产品的上市速度。本书是全面介绍DFX在封装中应用的图书。作为封装工艺过程和快速可靠性评估及测试建模仿真的第一本专著，《微电子封装组件的建模和仿真：制造可靠性与测试》中包含两位作者刘胜、刘勇在工业界二十多年的丰富经验，以及在MEMS、IC和LED封装部分成功的实例，希望能给国内同行起到抛砖引玉的作用。同时，读者将会从书中的先进工程设计和微电子产品的并行工程和协同设计方法中受益。《微电子封装组件的建模和仿真：制造可靠性与测试》主要读者对象为学习DFX（制造工艺设计、测试设计、可靠性设计等）的研究人员、工程师和学生等。 Foreword
Foreword
Preface
Acknowledgments
AbouttheAutho
PartIMechanicsandModeling
1Co titutiveModelsandFiniteElementMethod
1.1Co titutiveModelsforTypicalMaterials
1.1.1LinearElasticity
1.1.2Elastic-Visco-Plasticity
1.2FiniteElementMethod
1.2.1BasicFiniteElementEquatio
1.2.2NonlinearSolutionMethods
1.2.3AdvancedModelingTechniquesinFinite
ElementAnalysis
1.2.4FiniteElementApplicationinSemiconductor
PackagingModeling
1.3ChapterSummary
References

2MaterialandStructuralTestingforSmallSamples
2.1MaterialTestingforSolderJoints
2.1.1Specime
2.1.2AThermo-mechanicalFatigueTester
2.1.3Te ileTest
2.1.4CreepTest
2.1.5FatigueTest
2.2ScaleEffectofPackagingMaterials
2.2.1Specime
2.2.2ExperimentalResultsandDiscussio
2.2.3ThinFilmScaleDependenceforPolymerThinFilms
2.3Two-ballJointSpecimenFatigueTesting
2.4ChapterSummary
References

3Co titutiveandUse-suppliedSubroutinesforSolde
Co ideringDamageEvolution
3.1Co titutiveModelforTin-leadSolderJoint
3.1.1ModelFormulation
3.1.2DeterminationofMaterialCo tants
3.1.3ModelPrediction
3.2Visco-elastic-plasticPropertiesandCo titutiveModelingofUnder?lls
3.2.1Co titutiveModelingofUnder?lls
3.2.2Identi?cationofMaterialCo tants
3.2.3ModelVeri?cationandPrediction
3.3ADamageCouplingFrameworkofUni?edViscoplasticity
fortheFatigureofSolderAlloys
3.3.1DamageCouplingThermodynamicFramework
3.3.2LargeDeformationFormulation
3.3.3Identi?cationoftheMaterialParamete
3.3.4CreepDamage
3.4User-suppliedSubroutinesforSolde Co idering
DamageEvolution
3.4.1Return-MappingAlgorithmandFEAImplementation
3.4.2AdvancedFeaturesoftheImplementation
3.4.3Applicatio oftheMethodology
3.5ChapterSummary
References

4AcceleratedFatigueLifeAssessmentApproachesforSolde
inPackages
4.1LifePredictionMethodology
4.1.1Strain-BasedApproach
4.1.2Energy-BasedApproach
4.1.3FractureMechanics-BasedApproach
4.2AcceleratedTestingMethodology
4.2.1FailureModesviaAcceleratedTestingBounds
4.2.2IsothermalFatigueviaThermalFatigue
4.3Co titutiveModelingMethodology
4.3.1SeparatedModelingviaUni?edModeling
4.3.2ViscoplasticitywithDamageEvolution
4.4SolderJointReliabilityviaFEA
4.4.1LifePredictionofFordJointSpecimen
4.4.2AcceleratedTesting:I ightsfromLifePrediction
4.4.3FatigueLifePredictionofaPQFPPackage
4.5LifePredictionofFlip-ChipPackages
4.5.1FatigueLifePredictionwithandwithoutUnder?ll
4.5.2LifePredictionofFlip-ChipswithoutUnder?llviaUni?edandSeparated
Co titutiveModeling
4.5.3LifePredictionofFlip-ChipsunderAcceleratedTesting
4.6ChapterSummary
References

5Multi-physicsandMulti-scaleModeling
5.1Multi-physicsModeling
5.1.1Direct-coupledAnalysis
5.1.2SequentialCoupling
5.2Multi-scaleModeling
5.3ChapterSummary
References

6ModelingValidationTools
6.1StructuralMechanicsAnalysis
6.2RequirementsofExperimentalMethodsforStructural
MechanicsAnalysis
6.3WholeFieldOpticalTechniques
6.4ThermalStrai MeasurementsUsingMoireInterferometry
6.4.1ThermalStrai inaPlasticBallGridArray
（PBGA）Interconnection
6.4.2Real-timeThermalDeformationMeasurements
UsingMoireInteferometry
6.5In-situMeasurementsonMicro-machinedSe o
6.5.1Micro-machinedMembraneStructure
inaChemicalSe or
6.5.2In-situMeasurementUsingTwyman-Green
Interferometry
6.5.3MembraneDeformatio duetoPowerCycles
6.6Real-timeMeasurementsUsingSpeckleInteferometry
6.7ImageProcessingandComputerAidedOpticalTechniques
6.7.1ImageProcessingforFringeAnalysis
6.7.2PhaseShiftingTechniqueforIncreasing
DisplacementResolution
6.8Real-TimeThermal-MechanicalLoadingTools
6.8.1MicroMechanicalTesting
6.8.2EnvironmentalChamber
6.9WarpageMeasurementUsingPM-SMSystem
6.9.1ShadowMoireandProjectMoireSetup
6.9.2WarpageMeasurementofaBGA,TwoCrowdedPCBs
6.10ChapterSummary
References

7ApplicationofFractureMechanics
7.1FundamentalofFractureMechanics
7.1.1EnergyReleaseRate
7.1.2JIntegral
7.1.3InterfacialCrack
7.2BulkMaterialCracksinElectronicPackages
7.2.1Background
7.2.2CrackPropagationinCeramic/Adhesive/GlassSystem
7.2.3Results
7.3InterfacialFractureToughness
7.3.1Background
7.3.2InterfacialFractureToughnessofFlip-chipPackage
betweenPassivatedSiliconChipandUnder?ll
7.4Three-dime ionalEnergyReleaseRateCalculation
7.4.1FractureAnalysis
7.4.2ResultsandComparison
7.5ChapterSummary
References

8ConcurrentEngineeringforMicroelectronics
8.1DesignOptimizatio
8.2NewDevelopmentsandTrendsinIntegrated
DesignTools
8.3ChapterSummary
References

9TypicalICPackagingandAssemblyProcesses
9.1WaferProcessandThinning
9.1.1WaferProcessStressModels
9.1.2ThinFilmDeposition
9.1.3BacksideGrindforThinning
9.2DiePickUp
9.3DieAttach
9.3.1MaterialCo titutiveRelatio
9.3.2ModelingandNumericalStrategies
9.3.3FEASimulationResultofFlip-ChipAttach
9.4WireBonding
9.4.1Assumption,MaterialPropertiesandMethodofAnalysis
9.4.2WireBondingProcesswithDifferentParamete
9.4.3ImpactofUltrasonicAmplitude
9.4.4ImpactofUltrasonicFrequency
9.4.5ImpactofFrictionCoef?cientsbetweenBondPadandFAB
9.4.6ImpactofDifferentBondPadThickness
9.4.7ImpactofDifferentBondPadStructures
9.4.8ModelingResultsandDiscussionforCoolingSubstrate
TemperatureafterWireBonding
9.5Molding
9.5.1MoldingFlowSimulation
9.5.2CuringStressModel
9.5.3MoldingEjectionandClampingSimulation
9.6LeadframeForming/Singulation
9.6.1EulerForwardve usBackwardSolutionMethod
9.6.2PunchProcessSetup
9.6.3PunchSimulationbyANSYSImplicit
9.6.4PunchSimulationbyLS-DYNA
9.6.5ExperimentalData
9.7ChapterSummary
References

10OptoPackagingandAssembly
10.1SiliconSubstrateBasedOptoPackageAssembly
10.1.1StateoftheTechnology
10.1.2MonteCarloSimulationofBonding/SolderingProcess
10.1.3EffectofMatchingFluid
10.1.4EffectoftheEncapsulation
10.2WeldingofaPumpLaserModule
10.2.1ModuleDescription
10.2.2ModulePackagingProcessFlow
10.2.3RadiationHeatTra ferModelingforHermetic
SealingProcess
10.2.4Two-Dime ionalFEAModelingforHermeticSealing
10.2.5CavityRadiationAnalysesResultsandDiscussio
10.3ChapterSummary
References

11MEMSandMEMSPackageAssembly
11.1APressureSe orPackaging（DeformationandStress）
11.1.1PiezoresistanceinSilicon
11.1.2FiniteElementModelingandGeometry
11.1.3MaterialProperties
11.1.4ResultsandDiscussion
11.2MountingofPressureSe or
11.2.1MountingProcess
11.2.2Modeling
11.2.3Results
11.2.4ExperimentsandDiscussio
11.3Thermo-FluidBasedAccelerometerPackaging
11.3.1DeviceStructureandOperationPrinciple
11.3.2LinearityAnalysis
11.3.3DesignCo ideration
11.3.4Fabrication
11.3.5Experiment
11.4PlasticPackagingforACapacitanceBasedAccelerometer
11.4.1Micro-MachinedAccelerometer
11.4.2Wafer-LevelPackaging
11.4.3PackagingofCappedAccelerometer
11.5TirePressureMonitoringSystem（TPMS）Antenna
11.5.1TestofTPMSSystemwithWheelAntenna
11.5.23DElectromagneticModelingofTheWheelAntenna
11.5.3StressModelingofI talledTPMS
11.6Thermo-FluidBasedGyroscopePackaging
11.6.1OperatingPrincipleandDesign
11.6.2AnalysisofAngularAccelerationCoupling
11.6.3NumericalSimulationandAnalysis
11.7MicrojetsforRadarandLEDCooling
11.7.1MicrojetArrayCoolingSystem
11.7.2PreliminaryExperiments
11.7.3SimulationandModelVeri?cation
11.7.4ComparisonandOptimizationofThreeMicrojetDevices
11.8AirFlowSe or
11.8.1OperationPrinciple
11.8.2SimulationofFlowConditio
11.8.3SimulationofTemperatureFieldontheSe or
ChipSurface
11.9DirectNumericalSimulationofParticleSeparation
byDirectCurrentDielectrophoresis
11.9.1MathematicalModelandImplementation
11.9.2ResultsandDiscussion
11.10ModelingofMicro-MachineforUseinGastrointestinalEndoscopy
11.10.1Methods
11.10.2ResultsandDiscussion
11.11ChapterSummary
Reference

12SysteminPackage（SIP）Assembly
12.1AssemblyProcessofSidebySidePlacedSIP
12.1.1MultipleDieAttachProcess
12.1.2CoolingStressandWarpageSimulationafterMolding
12.1.3StressSimulationinTrimProcess
12.2ImpactoftheNonlinearMaterialsBehavio ontheFlip-chip
PackagingAssemblyReliability
12.2.1FiniteElementModelingandEffectofMaterialModels
12.2.2Experiment
12.2.3ResultsandDiscussio
12.3StackedDieFlip-chipAssemblyLayoutandtheMaterialSelection
12.3.1FiniteElementModelfortheStackDieFSBGA
12.3.2AssemblyLayoutInvestigation
12.3.3MaterialSelection
12.4ChapterSummary
References
PartIIIModelinginMicroelectronicPackageReliabilityandTest

13WaferProbingTest
13.1ProbeTestModel
13.2ParameterProbeTestModelingResultsandDiscussio
13.2.1ImpactofProbeTipGeometryShapes
13.2.2ImpactofContactFriction
13.2.3ImpactofProbeTipScrub
13.3ComparisonModeling:ProbeTestve usWireBonding
13.4DesignofExperiment（DOE）StudyandCorrelationofProbing
ExperimentandFEAModeling
13.5ChapterSummary
References

14PowerandThermalCycling,SolderJointFatigueLife
14.1DieAttachProcessandMaterialRelatio
14.2PowerCyclingModelingandDiscussion
14.3ThermalCyclingModelingandDiscussion
14.4MethodologyofSolderJointFatigueLifePrediction
14.5FatigueLifePredictionofaStackDieFlip-chiponSilicon（FSBGA）
14.6EffectofCleanedandNon-CleanedSituatio ontheReliability
ofFlip-ChipPackages
14.6.1FiniteElementModelsfortheCleanandNon-CleanCases
14.6.2ModelEvaluation
14.6.3ReliabilityStudyfortheSolderJoints
14.7ChapterSummary
References

15PassivationCrackAvoidance
15.1Ratcheting-InducedStableCracking:ASynopsis
15.2RatchetinginMetalFilms
15.3CrackinginPassivationFilms
15.4DesignModi?catio
15.5ChapterSummary
References

16DropTest
16.1ControlledPulseDropTest
16.1.1SimulationMethods
16.1.2SimulationResults
16.1.3ParametricStudy
16.2FreeDrop
16.2.1SimulatedDropTestProcedure
16.2.2ModelingResultsandDiscussion
16.3PortableElectronicDevicesDropTestandSimulation
16.3.1TestSetUp
16.3.2ModelingandSimulation
16.3.3Results
16.4ChapterSummary
References

17Electromigration
17.1BasicMigrationFormulationandAlgorithm
17.2ElectromigrationExamplesfromICDeviceandPackage
17.2.1ASweatStructure
17.2.2AFlip-chipCSPwithSolderBumps
17.3ChapterSummary
References

18PopcorninginPlasticPackages
18.1StatementofProblem
18.2Analysis
18.3ResultsandCompariso
18.3.1BehaviorofaDelaminatedPackageduetoPulsed
Heating-Veri?cation
18.3.2ConvergenceoftheTotalStrainEnergyReleaseRate
18.3.3EffectofDelaminationSizeandVariousProcesses
foraThickPackage
18.3.4EffectofMoistureExpa ionCoef?cient
18.4ChapterSummary
References
PartIVModernModelingandSimulationMethodologies

19ClassicalMolecularDynamics
19.1GeneralDescriptionofMolecularDynamicsMethod
19.2MechanismofCarbonNanotubeWeldingontotheMetal
19.2.1ComputationalMethodology
19.2.2ResultsandDiscussion
19.3Applicatio ofCar–ParrinelloMolecularDynamics
19.3.1Car–ParrinelloSimulationofInitialGrowthStage
ofGalliumNitrideonCarbonNanotube
19.3.2EffectsofMechanicalDeformationonOuterSurface
ReactivityofCarbonNanotubes
19.3.3AdsorptionCon?gurationofMagnesiumonWurtzite
GalliumNitrideSurfaceUsingFi t-principlesCalculatio
19.4Nano-weldingbyRFHeating
19.5ChapterSummary
References
Appendix
SummaryofContinuousMechanics
Index
内容简介:
　　随着电子封装的发展，电子封装已从传统的四个主要功能（电源系统、信号分布及传递、散热及机械保护）扩展为六个功能，即增加了DFX及系统测试两个新的功能。其中DFX是为“X”而设计，X包括：可制造性、可靠性、可维护性、成本，甚至六西格玛。DFX有望在产品设计阶段实现工艺窗口的确定、可靠性评估和测试结构及参数的设计等功能，真正做到“第一次就能成功”，从而将计算机辅助工程（CAE）变为计算机主导工程（CE），以大大加速产品的上市速度。本书是全面介绍DFX在封装中应用的图书。作为封装工艺过程和快速可靠性评估及测试建模仿真的第一本专著，《微电子封装组件的建模和仿真：制造可靠性与测试》中包含两位作者刘胜、刘勇在工业界二十多年的丰富经验，以及在MEMS、IC和LED封装部分成功的实例，希望能给国内同行起到抛砖引玉的作用。同时，读者将会从书中的先进工程设计和微电子产品的并行工程和协同设计方法中受益。《微电子封装组件的建模和仿真：制造可靠性与测试》主要读者对象为学习DFX（制造工艺设计、测试设计、可靠性设计等）的研究人员、工程师和学生等。
目录:
Foreword
Foreword
Preface
Acknowledgments
AbouttheAutho
PartIMechanicsandModeling
1Co titutiveModelsandFiniteElementMethod
1.1Co titutiveModelsforTypicalMaterials
1.1.1LinearElasticity
1.1.2Elastic-Visco-Plasticity
1.2FiniteElementMethod
1.2.1BasicFiniteElementEquatio
1.2.2NonlinearSolutionMethods
1.2.3AdvancedModelingTechniquesinFinite
ElementAnalysis
1.2.4FiniteElementApplicationinSemiconductor
PackagingModeling
1.3ChapterSummary
References

2MaterialandStructuralTestingforSmallSamples
2.1MaterialTestingforSolderJoints
2.1.1Specime
2.1.2AThermo-mechanicalFatigueTester
2.1.3Te ileTest
2.1.4CreepTest
2.1.5FatigueTest
2.2ScaleEffectofPackagingMaterials
2.2.1Specime
2.2.2ExperimentalResultsandDiscussio
2.2.3ThinFilmScaleDependenceforPolymerThinFilms
2.3Two-ballJointSpecimenFatigueTesting
2.4ChapterSummary
References

3Co titutiveandUse-suppliedSubroutinesforSolde
Co ideringDamageEvolution
3.1Co titutiveModelforTin-leadSolderJoint
3.1.1ModelFormulation
3.1.2DeterminationofMaterialCo tants
3.1.3ModelPrediction
3.2Visco-elastic-plasticPropertiesandCo titutiveModelingofUnder?lls
3.2.1Co titutiveModelingofUnder?lls
3.2.2Identi?cationofMaterialCo tants
3.2.3ModelVeri?cationandPrediction
3.3ADamageCouplingFrameworkofUni?edViscoplasticity
fortheFatigureofSolderAlloys
3.3.1DamageCouplingThermodynamicFramework
3.3.2LargeDeformationFormulation
3.3.3Identi?cationoftheMaterialParamete
3.3.4CreepDamage
3.4User-suppliedSubroutinesforSolde Co idering
DamageEvolution
3.4.1Return-MappingAlgorithmandFEAImplementation
3.4.2AdvancedFeaturesoftheImplementation
3.4.3Applicatio oftheMethodology
3.5ChapterSummary
References

4AcceleratedFatigueLifeAssessmentApproachesforSolde
inPackages
4.1LifePredictionMethodology
4.1.1Strain-BasedApproach
4.1.2Energy-BasedApproach
4.1.3FractureMechanics-BasedApproach
4.2AcceleratedTestingMethodology
4.2.1FailureModesviaAcceleratedTestingBounds
4.2.2IsothermalFatigueviaThermalFatigue
4.3Co titutiveModelingMethodology
4.3.1SeparatedModelingviaUni?edModeling
4.3.2ViscoplasticitywithDamageEvolution
4.4SolderJointReliabilityviaFEA
4.4.1LifePredictionofFordJointSpecimen
4.4.2AcceleratedTesting:I ightsfromLifePrediction
4.4.3FatigueLifePredictionofaPQFPPackage
4.5LifePredictionofFlip-ChipPackages
4.5.1FatigueLifePredictionwithandwithoutUnder?ll
4.5.2LifePredictionofFlip-ChipswithoutUnder?llviaUni?edandSeparated
Co titutiveModeling
4.5.3LifePredictionofFlip-ChipsunderAcceleratedTesting
4.6ChapterSummary
References

5Multi-physicsandMulti-scaleModeling
5.1Multi-physicsModeling
5.1.1Direct-coupledAnalysis
5.1.2SequentialCoupling
5.2Multi-scaleModeling
5.3ChapterSummary
References

6ModelingValidationTools
6.1StructuralMechanicsAnalysis
6.2RequirementsofExperimentalMethodsforStructural
MechanicsAnalysis
6.3WholeFieldOpticalTechniques
6.4ThermalStrai MeasurementsUsingMoireInterferometry
6.4.1ThermalStrai inaPlasticBallGridArray
（PBGA）Interconnection
6.4.2Real-timeThermalDeformationMeasurements
UsingMoireInteferometry
6.5In-situMeasurementsonMicro-machinedSe o
6.5.1Micro-machinedMembraneStructure
inaChemicalSe or
6.5.2In-situMeasurementUsingTwyman-Green
Interferometry
6.5.3MembraneDeformatio duetoPowerCycles
6.6Real-timeMeasurementsUsingSpeckleInteferometry
6.7ImageProcessingandComputerAidedOpticalTechniques
6.7.1ImageProcessingforFringeAnalysis
6.7.2PhaseShiftingTechniqueforIncreasing
DisplacementResolution
6.8Real-TimeThermal-MechanicalLoadingTools
6.8.1MicroMechanicalTesting
6.8.2EnvironmentalChamber
6.9WarpageMeasurementUsingPM-SMSystem
6.9.1ShadowMoireandProjectMoireSetup
6.9.2WarpageMeasurementofaBGA,TwoCrowdedPCBs
6.10ChapterSummary
References

7ApplicationofFractureMechanics
7.1FundamentalofFractureMechanics
7.1.1EnergyReleaseRate
7.1.2JIntegral
7.1.3InterfacialCrack
7.2BulkMaterialCracksinElectronicPackages
7.2.1Background
7.2.2CrackPropagationinCeramic/Adhesive/GlassSystem
7.2.3Results
7.3InterfacialFractureToughness
7.3.1Background
7.3.2InterfacialFractureToughnessofFlip-chipPackage
betweenPassivatedSiliconChipandUnder?ll
7.4Three-dime ionalEnergyReleaseRateCalculation
7.4.1FractureAnalysis
7.4.2ResultsandComparison
7.5ChapterSummary
References

8ConcurrentEngineeringforMicroelectronics
8.1DesignOptimizatio
8.2NewDevelopmentsandTrendsinIntegrated
DesignTools
8.3ChapterSummary
References

9TypicalICPackagingandAssemblyProcesses
9.1WaferProcessandThinning
9.1.1WaferProcessStressModels
9.1.2ThinFilmDeposition
9.1.3BacksideGrindforThinning
9.2DiePickUp
9.3DieAttach
9.3.1MaterialCo titutiveRelatio
9.3.2ModelingandNumericalStrategies
9.3.3FEASimulationResultofFlip-ChipAttach
9.4WireBonding
9.4.1Assumption,MaterialPropertiesandMethodofAnalysis
9.4.2WireBondingProcesswithDifferentParamete
9.4.3ImpactofUltrasonicAmplitude
9.4.4ImpactofUltrasonicFrequency
9.4.5ImpactofFrictionCoef?cientsbetweenBondPadandFAB
9.4.6ImpactofDifferentBondPadThickness
9.4.7ImpactofDifferentBondPadStructures
9.4.8ModelingResultsandDiscussionforCoolingSubstrate
TemperatureafterWireBonding
9.5Molding
9.5.1MoldingFlowSimulation
9.5.2CuringStressModel
9.5.3MoldingEjectionandClampingSimulation
9.6LeadframeForming/Singulation
9.6.1EulerForwardve usBackwardSolutionMethod
9.6.2PunchProcessSetup
9.6.3PunchSimulationbyANSYSImplicit
9.6.4PunchSimulationbyLS-DYNA
9.6.5ExperimentalData
9.7ChapterSummary
References

10OptoPackagingandAssembly
10.1SiliconSubstrateBasedOptoPackageAssembly
10.1.1StateoftheTechnology
10.1.2MonteCarloSimulationofBonding/SolderingProcess
10.1.3EffectofMatchingFluid
10.1.4EffectoftheEncapsulation
10.2WeldingofaPumpLaserModule
10.2.1ModuleDescription
10.2.2ModulePackagingProcessFlow
10.2.3RadiationHeatTra ferModelingforHermetic
SealingProcess
10.2.4Two-Dime ionalFEAModelingforHermeticSealing
10.2.5CavityRadiationAnalysesResultsandDiscussio
10.3ChapterSummary
References

11MEMSandMEMSPackageAssembly
11.1APressureSe orPackaging（DeformationandStress）
11.1.1PiezoresistanceinSilicon
11.1.2FiniteElementModelingandGeometry
11.1.3MaterialProperties
11.1.4ResultsandDiscussion
11.2MountingofPressureSe or
11.2.1MountingProcess
11.2.2Modeling
11.2.3Results
11.2.4ExperimentsandDiscussio
11.3Thermo-FluidBasedAccelerometerPackaging
11.3.1DeviceStructureandOperationPrinciple
11.3.2LinearityAnalysis
11.3.3DesignCo ideration
11.3.4Fabrication
11.3.5Experiment
11.4PlasticPackagingforACapacitanceBasedAccelerometer
11.4.1Micro-MachinedAccelerometer
11.4.2Wafer-LevelPackaging
11.4.3PackagingofCappedAccelerometer
11.5TirePressureMonitoringSystem（TPMS）Antenna
11.5.1TestofTPMSSystemwithWheelAntenna
11.5.23DElectromagneticModelingofTheWheelAntenna
11.5.3StressModelingofI talledTPMS
11.6Thermo-FluidBasedGyroscopePackaging
11.6.1OperatingPrincipleandDesign
11.6.2AnalysisofAngularAccelerationCoupling
11.6.3NumericalSimulationandAnalysis
11.7MicrojetsforRadarandLEDCooling
11.7.1MicrojetArrayCoolingSystem
11.7.2PreliminaryExperiments
11.7.3SimulationandModelVeri?cation
11.7.4ComparisonandOptimizationofThreeMicrojetDevices
11.8AirFlowSe or
11.8.1OperationPrinciple
11.8.2SimulationofFlowConditio
11.8.3SimulationofTemperatureFieldontheSe or
ChipSurface
11.9DirectNumericalSimulationofParticleSeparation
byDirectCurrentDielectrophoresis
11.9.1MathematicalModelandImplementation
11.9.2ResultsandDiscussion
11.10ModelingofMicro-MachineforUseinGastrointestinalEndoscopy
11.10.1Methods
11.10.2ResultsandDiscussion
11.11ChapterSummary
Reference

12SysteminPackage（SIP）Assembly
12.1AssemblyProcessofSidebySidePlacedSIP
12.1.1MultipleDieAttachProcess
12.1.2CoolingStressandWarpageSimulationafterMolding
12.1.3StressSimulationinTrimProcess
12.2ImpactoftheNonlinearMaterialsBehavio ontheFlip-chip
PackagingAssemblyReliability
12.2.1FiniteElementModelingandEffectofMaterialModels
12.2.2Experiment
12.2.3ResultsandDiscussio
12.3StackedDieFlip-chipAssemblyLayoutandtheMaterialSelection
12.3.1FiniteElementModelfortheStackDieFSBGA
12.3.2AssemblyLayoutInvestigation
12.3.3MaterialSelection
12.4ChapterSummary
References
PartIIIModelinginMicroelectronicPackageReliabilityandTest

13WaferProbingTest
13.1ProbeTestModel
13.2ParameterProbeTestModelingResultsandDiscussio
13.2.1ImpactofProbeTipGeometryShapes
13.2.2ImpactofContactFriction
13.2.3ImpactofProbeTipScrub
13.3ComparisonModeling:ProbeTestve usWireBonding
13.4DesignofExperiment（DOE）StudyandCorrelationofProbing
ExperimentandFEAModeling
13.5ChapterSummary
References

14PowerandThermalCycling,SolderJointFatigueLife
14.1DieAttachProcessandMaterialRelatio
14.2PowerCyclingModelingandDiscussion
14.3ThermalCyclingModelingandDiscussion
14.4MethodologyofSolderJointFatigueLifePrediction
14.5FatigueLifePredictionofaStackDieFlip-chiponSilicon（FSBGA）
14.6EffectofCleanedandNon-CleanedSituatio ontheReliability
ofFlip-ChipPackages
14.6.1FiniteElementModelsfortheCleanandNon-CleanCases
14.6.2ModelEvaluation
14.6.3ReliabilityStudyfortheSolderJoints
14.7ChapterSummary
References

15PassivationCrackAvoidance
15.1Ratcheting-InducedStableCracking:ASynopsis
15.2RatchetinginMetalFilms
15.3CrackinginPassivationFilms
15.4DesignModi?catio
15.5ChapterSummary
References

16DropTest
16.1ControlledPulseDropTest
16.1.1SimulationMethods
16.1.2SimulationResults
16.1.3ParametricStudy
16.2FreeDrop
16.2.1SimulatedDropTestProcedure
16.2.2ModelingResultsandDiscussion
16.3PortableElectronicDevicesDropTestandSimulation
16.3.1TestSetUp
16.3.2ModelingandSimulation
16.3.3Results
16.4ChapterSummary
References

17Electromigration
17.1BasicMigrationFormulationandAlgorithm
17.2ElectromigrationExamplesfromICDeviceandPackage
17.2.1ASweatStructure
17.2.2AFlip-chipCSPwithSolderBumps
17.3ChapterSummary
References

18PopcorninginPlasticPackages
18.1StatementofProblem
18.2Analysis
18.3ResultsandCompariso
18.3.1BehaviorofaDelaminatedPackageduetoPulsed
Heating-Veri?cation
18.3.2ConvergenceoftheTotalStrainEnergyReleaseRate
18.3.3EffectofDelaminationSizeandVariousProcesses
foraThickPackage
18.3.4EffectofMoistureExpa ionCoef?cient
18.4ChapterSummary
References
PartIVModernModelingandSimulationMethodologies

19ClassicalMolecularDynamics
19.1GeneralDescriptionofMolecularDynamicsMethod
19.2MechanismofCarbonNanotubeWeldingontotheMetal
19.2.1ComputationalMethodology
19.2.2ResultsandDiscussion
19.3Applicatio ofCar–ParrinelloMolecularDynamics
19.3.1Car–ParrinelloSimulationofInitialGrowthStage
ofGalliumNitrideonCarbonNanotube
19.3.2EffectsofMechanicalDeformationonOuterSurface
ReactivityofCarbonNanotubes
19.3.3AdsorptionCon?gurationofMagnesiumonWurtzite
GalliumNitrideSurfaceUsingFi t-principlesCalculatio
19.4Nano-weldingbyRFHeating
19.5ChapterSummary
References
Appendix
SummaryofContinuousMechanics
Index

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