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信号完整性与电源完整性分析（第三版）（英文版）

作者: [美] Eric Bogatin(埃里克 · 伯格丁

出版社: 电子工业出版社

出版时间: 2021-03

版次: 1

ISBN: 9787121407833

定价: 119.00

装帧: 其他

开本: 16开

纸张: 胶版纸

页数: 544页

字数: 1132千字

分类: 教材教辅考试>教材>大学教材>工程技术

14人买过

本书全面论述了信号完整性与电源完整性问题。主要讲述信号与电源完整性分析及物理设计概论，4类信号与电源完整性问题的实质含义，物理互连设计对信号完整性的影响，电容、电感、电阻和电导的特性分析，求解信号与电源完整性问题的4种实用技术途径，推导和仿真背后隐藏的解决方案，以及改进信号与电源完整性的推荐设计准则等。本书还讨论了信号与电源完整性中S参数的应用问题，并给出了电源分配网络的设计实例。本书强调直觉理解、实用工具和工程素养。作者以实践专家的视角指出造成信号与电源完整性问题的根源，并特别给出了设计阶段前期的问题解决方案。 Eric Bogatin beTheSignal.com网站Teledyne LeCroy Signal Integrity Academy的院长，美国科罗拉多大学博尔德分校电气、计算机与能源工程（ECEE）系兼职教授。Bogatin于麻省理工学院获得物理学士学位，于亚利桑那大学图森分校获得物理学硕士和博士学位。在全球范围内提供有关信号完整性的课程和讲座，并于2013年起通过网站为个人和公司提供在线培训课程。Bogatin是DesignCon的2016年度工程师奖的获得者。

Eric Bogatin beTheSignal.com网站Teledyne LeCroy Signal Integrity Academy的院长，美国科罗拉多大学博尔德分校电气、计算机与能源工程（ECEE）系兼职教授。Bogatin于麻省理工学院获得物理学士学位，于亚利桑那大学图森分校获得物理学硕士和博士学位。在全球范围内提供有关信号完整性的课程和讲座，并于2013年起通过网站为个人和公司提供在线培训课程。Bogatin是DesignCon的2016年度工程师奖的获得者。 Chapter 1 Signal Integrity Is in Your Future

1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?

1.2 Signal-Integrity Effects on One Net

1.3 Cross Talk

1.4 Rail-Collapse Noise

1.5 ElectroMagnetic Interference (EMI)

1.6 Two Important Signal-Integrity Generalizations

1.7 Trends in Electronic Products

1.8 The Need for a New Design Methodology

1.9 A New Product Design Methodology

1.10 Simulations

1.11 Modeling and Models

1.12 Creating Circuit Models from Calculation

1.13 Three Types of Measurements

1.14 The Role of Measurements

1.15 The Bottom Line

Chapter 2 Time and Frequency Domains

2.1 The Time Domain

2.2 Sine Waves in the Frequency Domain

2.3 Shorter Time to a Solution in the Frequency Domain

2.4 Sine-Wave Features

2.5 The Fourier Transform

2.6 The Spectrum of a Repetitive Signal

2.7 The Spectrum of an Ideal Square Wave

2.8 From the Frequency Domain to the Time Domain

2.9 Effect of Bandwidth on Rise Time

2.10 Bandwidth and Rise Time

2.11 What Does Significant Mean?

2.12 Bandwidth of Real Signals

2.13 Bandwidth and Clock Frequency

2.14 Bandwidth of a Measurement

2.15 Bandwidth of a Model

2.16 Bandwidth of an Interconnect

2.17 The Bottom Line

Chapter 3 Impedance and Electrical Models

3.1 Describing Signal-Integrity Solutions in Terms of Impedance

3.2 What Is Impedance?

3.3 Real Versus Ideal Circuit Elements

3.4 Impedance of an Ideal Resistor in the Time Domain

3.5 Impedance of an Ideal Capacitor in the Time Domain

3.6 Impedance of an Ideal Inductor in the Time Domain

3.7 Impedance in the Frequency Domain

3.8 Equivalent Electrical Circuit Models

3.9 Circuit Theory and SPICE

3.10 Introduction to Measurement-Based Modeling

3.11 The Bottom Line

Chapter 4 The Physical Basis of Resistance

4.1 Translating Physical Design into Electrical Performance

4.2 The Only Good Approximation for the Resistance of Interconnects

4.3 Bulk Resistivity

4.4 Resistance per Length

4.5 Sheet Resistance

4.6 The Bottom Line

Chapter 5 The Physical Basis of Capacitance

5.1 Current Flow in Capacitors

5.2 The Capacitance of a Sphere

5.3 Parallel Plate Approximation

5.4 Dielectric Constant

5.5 Power and Ground Planes and Decoupling Capacitance

5.6 Capacitance per Length

5.7 2D Field Solvers

5.8 Effective Dielectric Constant

5.9 The Bottom Line

Chapter 6 The Physical Basis of Inductance

6.1 What Is Inductance?

6.2 Inductance Principle 1: There Are Circular Rings of Magnetic-Field Lines Around All Currents

6.3 Inductance Principle 2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It

6.4 Self-Inductance and Mutual Inductance

6.5 Inductance Principle 3: When the Number of Field Line Rings Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor

6.6 Partial Inductance

6.7 Effective, Total, or Net Inductance and Ground Bounce

6.8 Loop Self- and Mutual Inductance

6.9 The Power Distribution Network (PDN) and Loop Inductance

6.10 Loop Inductance per Square of Planes

6.11 Loop Inductance of Planes and Via Contacts

6.12 Loop Inductance of Planes with a Field of Clearance Holes

6.13 Loop Mutual Inductance

6.14 Equivalent Inductance of Multiple Inductors

6.15 Summary of Inductance

6.16 Current Distributions and Skin Depth

6.17 High-Permeability Materials

6.18 Eddy Currents

6.19 The Bottom Line

Chapter 7 The Physical Basis of Transmission Lines

7.1 Forget the Word Ground

7.2 The Signal

7.3 Uniform Transmission Lines

7.4 The Speed of Electrons in Copper

7.5 The Speed of a Signal in a Transmission Line

7.6 Spatial Extent of the Leading Edge

7.7 “Be the Signal”

7.8 The Instantaneous Impedance of a Transmission Line

7.9 Characteristic Impedance and Controlled Impedance

7.10 Famous Characteristic Impedances

7.11 The Impedance of a Transmission Line

7.12 Driving a Transmission Line

7.13 Return Paths

7.14 When Return Paths Switch Reference Planes

7.15 A First-Order Model of a Transmission Line

7.16 Calculating Characteristic Impedance with Approximations

7.17 Calculating the Characteristic Impedance with a 2D Field Solver

7.18 An n-Section Lumped-Circuit Model

7.19 Frequency Variation of the Characteristic Impedance

7.20 The Bottom Line

Chapter 8 Transmission Lines and Reflections

8.1 Reflections at Impedance Changes

8.2 Why Are There Reflections?

8.3 Reflections from Resistive Loads

8.4 Source Impedance

8.5 Bounce Diagrams

8.6 Simulating Reflected Waveforms

8.7 Measuring Reflections with a TDR

8.8 Transmission Lines and Unintentional Discontinuities

8.9 When to Terminate

8.10 The Most Common Termination Strategy for Point-to-Point Topology

8.11 Reflections from Short Series Transmission Lines

8.12 Reflections from Short-Stub Transmission Lines

8.13 Reflections from Capacitive End Terminations

8.14 Reflections from Capacitive Loads in the Middle of a Trace

8.15 Capacitive Delay Adders

8.16 Effects of Corners and Vias

8.17 Loaded Lines

8.18 Reflections from Inductive Discontinuities

8.19 Compensation

8.20 The Bottom Line

Chapter 9 Lossy Lines, Rise-Time Degradation, and Material Properties

9.1 Why Worry About Lossy Lines?

9.2 Losses in Transmission Lines

9.3 Sources of Loss: Conductor Resistance and Skin Depth

9.4 Sources of Loss: The Dielectric

9.5 Dissipation Factor

9.6 The Real Meaning of Dissipation Factor

9.7 Modeling Lossy Transmission Lines

9.8 Characteristic Impedance of a Lossy Transmission Line

9.9 Signal Velocity in a Lossy Transmission Line

9.10 Attenuation and dB

9.11 Attenuation in Lossy Lines

9.12 Measured Properties of a Lossy Line in the Frequency Domain

9.13 The Bandwidth of an Interconnect

9.14 Time-Domain Behavior of Lossy Lines

9.15 Improving the Eye Diagram of a Transmission Line

9.16 How Much Attenuation Is Too Much?

9.17 The Bottom Line

Chapter 10 Cross Talk in Transmission Lines

10.1 Superposition

10.2 Origin of Coupling: Capacitance and Inductance

10.3 Cross Talk in Transmission Lines: NEXT and FEXT

10.4 Describing Cross Talk

10.5 The SPICE Capacitance Matrix

10.6 The Maxwell Capacitance Matrix and 2D Field Solvers

10.7 The Inductance Matrix

10.8 Cross Talk in Uniform Transmission Lines and Saturation Length

10.9 Capacitively Coupled Currents

10.10 Inductively Coupled Currents

10.11 Near-End Cross Talk

10.12 Far-End Cross Talk

10.13 Decreasing Far-End Cross Talk

10.14 Simulating Cross Talk

10.15 Guard Traces

10.16 Cross Talk and Dielectric Constant

10.17 Cross Talk and Timing

10.18 Switching Noise

10.19 Summary of Reducing Cross Talk

10.20 The Bottom Line

Chapter 11 Differential Pairs and Differential Impedance

11.1 Differential Signaling

11.2 A Differential Pair

11.3 Differential Impedance with No Coupling

11.4 The Impact from Coupling

11.5 Calculating Differential Impedance

11.6 The Return-Current Distribution in a Differential Pair

11.7 Odd and Even Modes

11.8 Differential Impedance and Odd-Mode Impedance

11.9 Common Impedance and Even-Mode Impedance

11.10 Differential and Common Signals and Odd- and Even-Mode Voltage Components

11.11 Velocity of Each Mode and Far-End Cross Talk

11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair

11.13 Measuring Even- and Odd-Mode Im
内容简介:
本书全面论述了信号完整性与电源完整性问题。主要讲述信号与电源完整性分析及物理设计概论，4类信号与电源完整性问题的实质含义，物理互连设计对信号完整性的影响，电容、电感、电阻和电导的特性分析，求解信号与电源完整性问题的4种实用技术途径，推导和仿真背后隐藏的解决方案，以及改进信号与电源完整性的推荐设计准则等。本书还讨论了信号与电源完整性中S参数的应用问题，并给出了电源分配网络的设计实例。本书强调直觉理解、实用工具和工程素养。作者以实践专家的视角指出造成信号与电源完整性问题的根源，并特别给出了设计阶段前期的问题解决方案。
作者简介:
Eric Bogatin beTheSignal.com网站Teledyne LeCroy Signal Integrity Academy的院长，美国科罗拉多大学博尔德分校电气、计算机与能源工程（ECEE）系兼职教授。Bogatin于麻省理工学院获得物理学士学位，于亚利桑那大学图森分校获得物理学硕士和博士学位。在全球范围内提供有关信号完整性的课程和讲座，并于2013年起通过网站为个人和公司提供在线培训课程。Bogatin是DesignCon的2016年度工程师奖的获得者。

Eric Bogatin beTheSignal.com网站Teledyne LeCroy Signal Integrity Academy的院长，美国科罗拉多大学博尔德分校电气、计算机与能源工程（ECEE）系兼职教授。Bogatin于麻省理工学院获得物理学士学位，于亚利桑那大学图森分校获得物理学硕士和博士学位。在全球范围内提供有关信号完整性的课程和讲座，并于2013年起通过网站为个人和公司提供在线培训课程。Bogatin是DesignCon的2016年度工程师奖的获得者。
目录:
Chapter 1 Signal Integrity Is in Your Future

1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?

1.2 Signal-Integrity Effects on One Net

1.3 Cross Talk

1.4 Rail-Collapse Noise

1.5 ElectroMagnetic Interference (EMI)

1.6 Two Important Signal-Integrity Generalizations

1.7 Trends in Electronic Products

1.8 The Need for a New Design Methodology

1.9 A New Product Design Methodology

1.10 Simulations

1.11 Modeling and Models

1.12 Creating Circuit Models from Calculation

1.13 Three Types of Measurements

1.14 The Role of Measurements

1.15 The Bottom Line

Chapter 2 Time and Frequency Domains

2.1 The Time Domain

2.2 Sine Waves in the Frequency Domain

2.3 Shorter Time to a Solution in the Frequency Domain

2.4 Sine-Wave Features

2.5 The Fourier Transform

2.6 The Spectrum of a Repetitive Signal

2.7 The Spectrum of an Ideal Square Wave

2.8 From the Frequency Domain to the Time Domain

2.9 Effect of Bandwidth on Rise Time

2.10 Bandwidth and Rise Time

2.11 What Does Significant Mean?

2.12 Bandwidth of Real Signals

2.13 Bandwidth and Clock Frequency

2.14 Bandwidth of a Measurement

2.15 Bandwidth of a Model

2.16 Bandwidth of an Interconnect

2.17 The Bottom Line

Chapter 3 Impedance and Electrical Models

3.1 Describing Signal-Integrity Solutions in Terms of Impedance

3.2 What Is Impedance?

3.3 Real Versus Ideal Circuit Elements

3.4 Impedance of an Ideal Resistor in the Time Domain

3.5 Impedance of an Ideal Capacitor in the Time Domain

3.6 Impedance of an Ideal Inductor in the Time Domain

3.7 Impedance in the Frequency Domain

3.8 Equivalent Electrical Circuit Models

3.9 Circuit Theory and SPICE

3.10 Introduction to Measurement-Based Modeling

3.11 The Bottom Line

Chapter 4 The Physical Basis of Resistance

4.1 Translating Physical Design into Electrical Performance

4.2 The Only Good Approximation for the Resistance of Interconnects

4.3 Bulk Resistivity

4.4 Resistance per Length

4.5 Sheet Resistance

4.6 The Bottom Line

Chapter 5 The Physical Basis of Capacitance

5.1 Current Flow in Capacitors

5.2 The Capacitance of a Sphere

5.3 Parallel Plate Approximation

5.4 Dielectric Constant

5.5 Power and Ground Planes and Decoupling Capacitance

5.6 Capacitance per Length

5.7 2D Field Solvers

5.8 Effective Dielectric Constant

5.9 The Bottom Line

Chapter 6 The Physical Basis of Inductance

6.1 What Is Inductance?

6.2 Inductance Principle 1: There Are Circular Rings of Magnetic-Field Lines Around All Currents

6.3 Inductance Principle 2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It

6.4 Self-Inductance and Mutual Inductance

6.5 Inductance Principle 3: When the Number of Field Line Rings Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor

6.6 Partial Inductance

6.7 Effective, Total, or Net Inductance and Ground Bounce

6.8 Loop Self- and Mutual Inductance

6.9 The Power Distribution Network (PDN) and Loop Inductance

6.10 Loop Inductance per Square of Planes

6.11 Loop Inductance of Planes and Via Contacts

6.12 Loop Inductance of Planes with a Field of Clearance Holes

6.13 Loop Mutual Inductance

6.14 Equivalent Inductance of Multiple Inductors

6.15 Summary of Inductance

6.16 Current Distributions and Skin Depth

6.17 High-Permeability Materials

6.18 Eddy Currents

6.19 The Bottom Line

Chapter 7 The Physical Basis of Transmission Lines

7.1 Forget the Word Ground

7.2 The Signal

7.3 Uniform Transmission Lines

7.4 The Speed of Electrons in Copper

7.5 The Speed of a Signal in a Transmission Line

7.6 Spatial Extent of the Leading Edge

7.7 “Be the Signal”

7.8 The Instantaneous Impedance of a Transmission Line

7.9 Characteristic Impedance and Controlled Impedance

7.10 Famous Characteristic Impedances

7.11 The Impedance of a Transmission Line

7.12 Driving a Transmission Line

7.13 Return Paths

7.14 When Return Paths Switch Reference Planes

7.15 A First-Order Model of a Transmission Line

7.16 Calculating Characteristic Impedance with Approximations

7.17 Calculating the Characteristic Impedance with a 2D Field Solver

7.18 An n-Section Lumped-Circuit Model

7.19 Frequency Variation of the Characteristic Impedance

7.20 The Bottom Line

Chapter 8 Transmission Lines and Reflections

8.1 Reflections at Impedance Changes

8.2 Why Are There Reflections?

8.3 Reflections from Resistive Loads

8.4 Source Impedance

8.5 Bounce Diagrams

8.6 Simulating Reflected Waveforms

8.7 Measuring Reflections with a TDR

8.8 Transmission Lines and Unintentional Discontinuities

8.9 When to Terminate

8.10 The Most Common Termination Strategy for Point-to-Point Topology

8.11 Reflections from Short Series Transmission Lines

8.12 Reflections from Short-Stub Transmission Lines

8.13 Reflections from Capacitive End Terminations

8.14 Reflections from Capacitive Loads in the Middle of a Trace

8.15 Capacitive Delay Adders

8.16 Effects of Corners and Vias

8.17 Loaded Lines

8.18 Reflections from Inductive Discontinuities

8.19 Compensation

8.20 The Bottom Line

Chapter 9 Lossy Lines, Rise-Time Degradation, and Material Properties

9.1 Why Worry About Lossy Lines?

9.2 Losses in Transmission Lines

9.3 Sources of Loss: Conductor Resistance and Skin Depth

9.4 Sources of Loss: The Dielectric

9.5 Dissipation Factor

9.6 The Real Meaning of Dissipation Factor

9.7 Modeling Lossy Transmission Lines

9.8 Characteristic Impedance of a Lossy Transmission Line

9.9 Signal Velocity in a Lossy Transmission Line

9.10 Attenuation and dB

9.11 Attenuation in Lossy Lines

9.12 Measured Properties of a Lossy Line in the Frequency Domain

9.13 The Bandwidth of an Interconnect

9.14 Time-Domain Behavior of Lossy Lines

9.15 Improving the Eye Diagram of a Transmission Line

9.16 How Much Attenuation Is Too Much?

9.17 The Bottom Line

Chapter 10 Cross Talk in Transmission Lines

10.1 Superposition

10.2 Origin of Coupling: Capacitance and Inductance

10.3 Cross Talk in Transmission Lines: NEXT and FEXT

10.4 Describing Cross Talk

10.5 The SPICE Capacitance Matrix

10.6 The Maxwell Capacitance Matrix and 2D Field Solvers

10.7 The Inductance Matrix

10.8 Cross Talk in Uniform Transmission Lines and Saturation Length

10.9 Capacitively Coupled Currents

10.10 Inductively Coupled Currents

10.11 Near-End Cross Talk

10.12 Far-End Cross Talk

10.13 Decreasing Far-End Cross Talk

10.14 Simulating Cross Talk

10.15 Guard Traces

10.16 Cross Talk and Dielectric Constant

10.17 Cross Talk and Timing

10.18 Switching Noise

10.19 Summary of Reducing Cross Talk

10.20 The Bottom Line

Chapter 11 Differential Pairs and Differential Impedance

11.1 Differential Signaling

11.2 A Differential Pair

11.3 Differential Impedance with No Coupling

11.4 The Impact from Coupling

11.5 Calculating Differential Impedance

11.6 The Return-Current Distribution in a Differential Pair

11.7 Odd and Even Modes

11.8 Differential Impedance and Odd-Mode Impedance

11.9 Common Impedance and Even-Mode Impedance

11.10 Differential and Common Signals and Odd- and Even-Mode Voltage Components

11.11 Velocity of Each Mode and Far-End Cross Talk

11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair

11.13 Measuring Even- and Odd-Mode Im

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信号完整性与电源完整性分析（第三版）（英文版）

内容简介:

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