Amorphous and Nano Alloys Electroless Deposition

作者: 张邦维著

出版社: 化学工业出版社

出版时间: 2017-03

版次: 1

ISBN: 9787122291608

定价: 498.00

装帧: 精装

开本: 16开

纸张: 胶版纸

页数: 749页

字数: 12540千字

正文语种: 英语

分类: 自然科学

8 张插图图片

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本书全面阐述了非晶态和纳米合金化学镀的制备原理（镀槽与稳定性，镀速及影响因素）、微观结构、机理、形成和形成区理论以及微观理论。本书突出原创，集中阐述了铁基化学镀合金镀层与非晶合金镀层形成和形成区理论等作者具有自主知识产权的成果，以及纳米合金化学镀、镀速统一分析、表面形貌及分析、形成和微观理论等内容，反映了国际化学镀发展的新内容。

作者以独特的视角讲述并分析了化学镀70 多年来的发展史。通过发现式写法，在阐述内容的同时，指出问题和发展方向，引导读者深入思考。

本书可供材料、物理、化学等相关学科科研技术人员、研究生，对科研和工业关心的公职与公众人士阅读。张邦维，湖南大学应用物理系，教授、博导，在物理和材料科学领域从事教学和科研愈50年，他的研究集中于纳米和非晶态材料， EP合金镀层，合金热力学和理论，EAM理论与应用，其成果得到国内外学术界的广泛引用和承认。他曾获得过德国马普奖学金，并两次在德国IPP(等离子体物理所)合作研究工作，也曾两次在美国弗吉尼亚大学材料科学工程系合作研究。他和他的研究组在纳米材料工作过20多年，集中于纳米材料各种制备方法及其形成理论上。 Preface xv

Part I

History of Electroless Plating

1. History–From the Discovery of Electroless Plating to the Present

1.1 Discovery of Electroless Plating 4

1.1.1 Early Works 4

1.1.2 Brenner and Riddell’s Work 6

1.2 Early Stage of Development (1940s–1959) 9

1.2.1 Research Works 9

1.2.2 Patents Issued 10

1.2.3 Preliminary Applications 12

1.3 Slow Growth of Period (1960–1979) 12

1.3.1 Improvement of the Plating Bath 13

1.3.2 Various Electroless Plating Metals 17

1.3.3 Electroless Plating Cu 20

1.3.4 Deposition Substrate 23

1.3.5 Application 26

1.4 Rapid Development of Period (1980–1999) 26

1.4.1 Studying the Nature of Electroless Plating 26

1.4.2 Studying the Properties of Electroless Plating Deposits 27

1.4.3 Large-Scale Application in Many Industries 31

1.4.4 Investigation of Ternary and Multicomponent Alloys and Composites 33

1.4.5 Electroless Plating Began and Developed Rapidly in China 34

1.4.6 Electroless Plating Fe–B Based Alloys Have Been Proposed and Developed 35

1.5 In-Depth Development and Nanoelectroless Plating Stage (2000–Present) 36

1.5.1 In-Depth Investigation of the Mechanism and Theory in Electroless Plating 38

1.5.2 Rapid Development of Nanoelectroless Plating 38

1.6 Summary and Prospect 39

References 40

Part II

Technology of Electroless Plating-Plating Bath, Critical Parameters, Deposition Rate,and Stability of Plating Bath

2. Electroless Plating Baths of Metals, Binary Alloys,and Multicomponent Alloys

2.1 General Consideration for Electroless Plating Bath Solution 51

2.2 Plating Bath of Electroless Pure Nickel and Nickel-Based Binary Alloys 53

2.2.1 Pure Ni and Co Metals 53

2.2.2 Ni–P 53

2.2.3 Ni–B 53

2.3 Cobalt-Based Binary Alloys 57

2.3.1 Co–P 57

2.3.2 Co–B 57

2.4 Cu and Copper-Based Binary Alloys 58

2.5 Au 58

2.6 Ag 58

2.7 Pd and Palladium-Based Binary Alloys 59

2.8 Pt and Platinum-Based Binary Alloys 59

2.9 Ru, Rh, Os, and Cr–P Binary Alloys 59

2.10 Group B Metals (Zn, Cd, In, Sn, Pb, As, Sb, and Bi) and a Few Binary Alloys of these Metals 62

2.11 Electroless Plating of Ternary Alloys 67

2.11.1 Ni–Me–P Alloy Plating Baths 67

2.11.2 Co–Me–P Alloy Plating Baths 74

2.11.3 Ni–Me–B Alloy Plating Baths 74

2.11.4 Co–Me–B Alloy Plating Baths 74

2.11.5 Other Ternary Alloy Plating Baths 89

2.12 Electroless Plating of Quaternary Alloys 90

2.12.1 Ni-Based Quaternary Alloy Plating Baths 90

2.12.2 Co-Based Quaternary Alloy Plating Baths 90

2.13 Electroless Plating Quinary and Multialloys 90

2.14 Summary 90

References 100

3. Electroless Composite Plating

3.1 General Considerations about ECP 109

3.2 Bath Solutions of ECP 110

3.2.1 Bath for Binary Alloy-Based ECP 110

3.2.2 Bath for Ternary Alloy-Based ECP 113

3.2.3 Bath for ECP With Two Kinds of Particles 116

3.3 Summary 116

References 138

4. Nano Electroless Plating

4.1 Bulk Nano EP Materials 144

4.1.1 Nano ECP 144

4.1.2 EP Three-Dimensional Nanostructured Materials (3D NSMs) 163

4.2 2D Nano EP Materials 172

4.2.1 EP 2D Nano Films 173

4.2.2 EP 2D Nanoplates 181

4.2.3 EP 2D Nanodisks 182

4.2.4 EP 2D Nanoshells and Nanosheets 183

4.2.5 EP 2D Nanowalls 184

4.2.6 EP 2D Nano Circles and Rings 185

4.2.7 EP 2D Nanohoneycomb 187

4.2.8 EP 2D Nanoline, Nanofi n Pattern, and 2D Nano Grating 188

4.3 Linear (1D) Nano EP Materials 191

4.3.1 EP Nanotubes 191

4.3.2 EP Nanowires 214

4.3.3 EP Nanorods 240

4.3.4 EP Nanobelts 246

4.4 Zero-Dimensional Nano EP Materials 250

4.4.1 EP Nanoparticles 251

4.4.2 EP Nanoparticle Arrays 262

4.4.3 EP Nanoparticles Other Than Spherical Shape 264

4.4.4 EP Core-Shell Nanoparticles 268

4.5 Summary 278

References 279

5. Electroless Plating Fe-Based Alloys

5.1 Why Electroless Plating Fe–B Alloys? 291

5.2 Discovery of EP Fe–B Alloys 292

5.2.1 The Plating Bath and Affective Parameters 294

5.2.2 Analysis of the Diffi culty in Obtaining EP Fe–B Alloys 295

5.2.3 Composition, Structure, and Properties of EP Fe–B Alloys 296

5.2.4 Formation Mechanism of EP Fe–B Alloys 303

5.2.5 Problems and Worthwhile Improvements for EP Fe–B Alloys 304

5.3 EP Binary Fe–B Alloys 305

5.4 EP Fe–B-Based Multicomponent Alloys 307

5.4.1 EP Fe–W–B Alloy Deposits 308

5.4.2 EP Fe–Mo–B Alloy Deposits 310

5.4.3 EP Fe–Sn–B Alloy Deposits 312

5.4.4 EP Fe–W–Mo–B Alloy Deposits 313

5.4.5 EP Fe–Ni–B Alloy Deposits 315

5.5 EP Fe–P Alloys 315

5.6 EP Fe–P-Based Ternary-Component Alloys 317

5.7 Summary 319

References 319
内容简介:
本书全面阐述了非晶态和纳米合金化学镀的制备原理（镀槽与稳定性，镀速及影响因素）、微观结构、机理、形成和形成区理论以及微观理论。本书突出原创，集中阐述了铁基化学镀合金镀层与非晶合金镀层形成和形成区理论等作者具有自主知识产权的成果，以及纳米合金化学镀、镀速统一分析、表面形貌及分析、形成和微观理论等内容，反映了国际化学镀发展的新内容。

作者以独特的视角讲述并分析了化学镀70 多年来的发展史。通过发现式写法，在阐述内容的同时，指出问题和发展方向，引导读者深入思考。

本书可供材料、物理、化学等相关学科科研技术人员、研究生，对科研和工业关心的公职与公众人士阅读。
作者简介:
张邦维，湖南大学应用物理系，教授、博导，在物理和材料科学领域从事教学和科研愈50年，他的研究集中于纳米和非晶态材料， EP合金镀层，合金热力学和理论，EAM理论与应用，其成果得到国内外学术界的广泛引用和承认。他曾获得过德国马普奖学金，并两次在德国IPP(等离子体物理所)合作研究工作，也曾两次在美国弗吉尼亚大学材料科学工程系合作研究。他和他的研究组在纳米材料工作过20多年，集中于纳米材料各种制备方法及其形成理论上。
目录:
Preface xv

Part I

History of Electroless Plating

1. History–From the Discovery of Electroless Plating to the Present

1.1 Discovery of Electroless Plating 4

1.1.1 Early Works 4

1.1.2 Brenner and Riddell’s Work 6

1.2 Early Stage of Development (1940s–1959) 9

1.2.1 Research Works 9

1.2.2 Patents Issued 10

1.2.3 Preliminary Applications 12

1.3 Slow Growth of Period (1960–1979) 12

1.3.1 Improvement of the Plating Bath 13

1.3.2 Various Electroless Plating Metals 17

1.3.3 Electroless Plating Cu 20

1.3.4 Deposition Substrate 23

1.3.5 Application 26

1.4 Rapid Development of Period (1980–1999) 26

1.4.1 Studying the Nature of Electroless Plating 26

1.4.2 Studying the Properties of Electroless Plating Deposits 27

1.4.3 Large-Scale Application in Many Industries 31

1.4.4 Investigation of Ternary and Multicomponent Alloys and Composites 33

1.4.5 Electroless Plating Began and Developed Rapidly in China 34

1.4.6 Electroless Plating Fe–B Based Alloys Have Been Proposed and Developed 35

1.5 In-Depth Development and Nanoelectroless Plating Stage (2000–Present) 36

1.5.1 In-Depth Investigation of the Mechanism and Theory in Electroless Plating 38

1.5.2 Rapid Development of Nanoelectroless Plating 38

1.6 Summary and Prospect 39

References 40

Part II

Technology of Electroless Plating-Plating Bath, Critical Parameters, Deposition Rate,and Stability of Plating Bath

2. Electroless Plating Baths of Metals, Binary Alloys,and Multicomponent Alloys

2.1 General Consideration for Electroless Plating Bath Solution 51

2.2 Plating Bath of Electroless Pure Nickel and Nickel-Based Binary Alloys 53

2.2.1 Pure Ni and Co Metals 53

2.2.2 Ni–P 53

2.2.3 Ni–B 53

2.3 Cobalt-Based Binary Alloys 57

2.3.1 Co–P 57

2.3.2 Co–B 57

2.4 Cu and Copper-Based Binary Alloys 58

2.5 Au 58

2.6 Ag 58

2.7 Pd and Palladium-Based Binary Alloys 59

2.8 Pt and Platinum-Based Binary Alloys 59

2.9 Ru, Rh, Os, and Cr–P Binary Alloys 59

2.10 Group B Metals (Zn, Cd, In, Sn, Pb, As, Sb, and Bi) and a Few Binary Alloys of these Metals 62

2.11 Electroless Plating of Ternary Alloys 67

2.11.1 Ni–Me–P Alloy Plating Baths 67

2.11.2 Co–Me–P Alloy Plating Baths 74

2.11.3 Ni–Me–B Alloy Plating Baths 74

2.11.4 Co–Me–B Alloy Plating Baths 74

2.11.5 Other Ternary Alloy Plating Baths 89

2.12 Electroless Plating of Quaternary Alloys 90

2.12.1 Ni-Based Quaternary Alloy Plating Baths 90

2.12.2 Co-Based Quaternary Alloy Plating Baths 90

2.13 Electroless Plating Quinary and Multialloys 90

2.14 Summary 90

References 100

3. Electroless Composite Plating

3.1 General Considerations about ECP 109

3.2 Bath Solutions of ECP 110

3.2.1 Bath for Binary Alloy-Based ECP 110

3.2.2 Bath for Ternary Alloy-Based ECP 113

3.2.3 Bath for ECP With Two Kinds of Particles 116

3.3 Summary 116

References 138

4. Nano Electroless Plating

4.1 Bulk Nano EP Materials 144

4.1.1 Nano ECP 144

4.1.2 EP Three-Dimensional Nanostructured Materials (3D NSMs) 163

4.2 2D Nano EP Materials 172

4.2.1 EP 2D Nano Films 173

4.2.2 EP 2D Nanoplates 181

4.2.3 EP 2D Nanodisks 182

4.2.4 EP 2D Nanoshells and Nanosheets 183

4.2.5 EP 2D Nanowalls 184

4.2.6 EP 2D Nano Circles and Rings 185

4.2.7 EP 2D Nanohoneycomb 187

4.2.8 EP 2D Nanoline, Nanofi n Pattern, and 2D Nano Grating 188

4.3 Linear (1D) Nano EP Materials 191

4.3.1 EP Nanotubes 191

4.3.2 EP Nanowires 214

4.3.3 EP Nanorods 240

4.3.4 EP Nanobelts 246

4.4 Zero-Dimensional Nano EP Materials 250

4.4.1 EP Nanoparticles 251

4.4.2 EP Nanoparticle Arrays 262

4.4.3 EP Nanoparticles Other Than Spherical Shape 264

4.4.4 EP Core-Shell Nanoparticles 268

4.5 Summary 278

References 279

5. Electroless Plating Fe-Based Alloys

5.1 Why Electroless Plating Fe–B Alloys? 291

5.2 Discovery of EP Fe–B Alloys 292

5.2.1 The Plating Bath and Affective Parameters 294

5.2.2 Analysis of the Diffi culty in Obtaining EP Fe–B Alloys 295

5.2.3 Composition, Structure, and Properties of EP Fe–B Alloys 296

5.2.4 Formation Mechanism of EP Fe–B Alloys 303

5.2.5 Problems and Worthwhile Improvements for EP Fe–B Alloys 304

5.3 EP Binary Fe–B Alloys 305

5.4 EP Fe–B-Based Multicomponent Alloys 307

5.4.1 EP Fe–W–B Alloy Deposits 308

5.4.2 EP Fe–Mo–B Alloy Deposits 310

5.4.3 EP Fe–Sn–B Alloy Deposits 312

5.4.4 EP Fe–W–Mo–B Alloy Deposits 313

5.4.5 EP Fe–Ni–B Alloy Deposits 315

5.5 EP Fe–P Alloys 315

5.6 EP Fe–P-Based Ternary-Component Alloys 317

5.7 Summary 319

References 319

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Amorphous and Nano Alloys Electroless Deposition

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